With the miniaturization, digitalization, high integration of electronic products and the high frequency and high speed development of signal transmission, the integrity of the signal is becoming more and more important. In particular, the acceleration of 5G Technology (fifth generation mobile communication technology) at home and abroad in the past two years, the integrated circuits used in the terminal electronic equipment and products are constantly developing towards high density, high speed and multi-functional direction. To this end, we must increase the wiring density of metal wires in integrated circuits, reduce the width of metal wires and the distance between wires, so as to increase device density and line density. However, with the gradual reduction of the size of electronic components, the inductance and capacitance effect between the conductors is gradually enhanced, signal delay and distortion are further generated, which makes the signal transmission delay (RC), interference noise enhancement, and power loss (P) dissipation increase; at the same time, the frequency of signal transmission increases (above GHz or above). The integrated circuit board is not only the carrier plate that supports the component, but it will be regarded as the electric plastid of the carrier signal carrier. In order to achieve the characteristic requirements of the signal transmission line, it is not only necessary to control the characteristics of the wire (width, precision, conductor thickness and so on), but also more important to the characteristics of the substrate medium of the printed board. The reasonable choice of medium material and parameter design of transmission line will have a decisive influence on the loss of transmission line.
So,the development of new low dielectric loss and low loss flexible matrix materials will be one of the most important solutions for the development of high frequency and high-speed transmission IC.
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