BH Copper clad amber polyimide film is a kind of biaxial tension PI film. Its thickness tolerance is small, and coefficient of thermal expansion(CTE) is low. This film is widely used for substrate of FCCL.
Small thickness tolerance
High temperature resistant
FCCL basement material
Available thickness: 12.5um, 25um, 50um
Relative dielectric constant
Dielectric loss factor（48-62HZ）
After completion of formula,the materials begin to polycondensation,flowing into resin storage,casted by casting machine,scrolling into imine furnace for complete drying,tension and imidization,and beginning to wind. After winding, start to strimming side or slitted as clients' demanding. Then the coil must be during corona treated and post-processed for good performance.
1. Packing in rolls(cardbord core or plastic core ) with bubble paper outside, plastic end cap, put into carton, then fasten with belt.
2. Carton will be marked with product name, specification, quantity information .