Copper Clad Amber Polyimide Film

Copper clad amber polyimide film Copper clad amber polyimide film is a kind of biaxial tension PI film. Its thickness tolerance is small, and coefficient of thermal expansion(CTE) is low. This film is widely used for substrate of FCCL. character: Small thickness tolerance Low CTE Halogen-free,...
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    BH copper clad amber polyimide film is a kind of biaxial tension PI film. Its thickness tolerance is small, and coefficient of thermal expansion(CTE) is low. This film is widely used for substrate of FCCL.


    character:

    Small thickness tolerance

    Low CTE

    Good tensile trength

    Insulation

    High temperature resistant

    Halogen-free, environment-friendly


    Application:

    FCCL basement material

    Available thickness: 12.5um


    Width:520mm,1040mm


    No

    Item

     

    Unit

    Index Value

    12.5

    25

    50


    1

    Density

    kg/m3

    1420±20

    2

    Tensile strength

    MD

    MPa

    ≥137

    ≥135


    TD

    ≥137

    135


    3

    Elongation rate

    MD&TD

    %

    ≥40

    4

    Shrinkage rate

    200

    %

    ≤0.4

    5

    Electrical strength(48-62HZ)

    kV/mm

    ≥160

    6

    Volume resistivity

    (200℃)

    Ω. cm

    ≥1.0×1015

    7

    Surface resistivity(200℃)

    Ω

    ≥1.0×1013

     8

    Relative dielectric constant


    ≤4

    9

    Dielectric loss factor(48-62HZ)


    ≤0.012

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